This work presents the development and experimental validation of an ultrasound piezoelectric sensor for thermoacoustic imaging that exploits printed circuit boards technology to define with high precision the sensor active area while minimizing manufacturing complexity and cost. A prototype single-channel sensor with 4x4 mm active area has been manufactured and experimentally validated in electrical and acoustic testbenches.
Vallicelli, E., Baig, M., Gala, A., Chirico, G., Baschirotto, A., De Matteis, M. (2022). Low-cost PVDF High-Frequency Ultrasound Sensor Design and Manufacturing for Thermoacoustic Imaging Applications. In ICECS 2022 - 29th IEEE International Conference on Electronics, Circuits and Systems, Proceedings (pp.1-4) [10.1109/ICECS202256217.2022.9971002].
Low-cost PVDF High-Frequency Ultrasound Sensor Design and Manufacturing for Thermoacoustic Imaging Applications
Vallicelli E. A.
;Baig M. H.;Chirico G.;Baschirotto A.;De Matteis M.
2022
Abstract
This work presents the development and experimental validation of an ultrasound piezoelectric sensor for thermoacoustic imaging that exploits printed circuit boards technology to define with high precision the sensor active area while minimizing manufacturing complexity and cost. A prototype single-channel sensor with 4x4 mm active area has been manufactured and experimentally validated in electrical and acoustic testbenches.I documenti in IRIS sono protetti da copyright e tutti i diritti sono riservati, salvo diversa indicazione.