This work presents the development and experimental validation of an ultrasound piezoelectric sensor for thermoacoustic imaging that exploits printed circuit boards technology to define with high precision the sensor active area while minimizing manufacturing complexity and cost. A prototype single-channel sensor with 4x4 mm active area has been manufactured and experimentally validated in electrical and acoustic testbenches.

Vallicelli, E., Baig, M., Gala, A., Chirico, G., Baschirotto, A., De Matteis, M. (2022). Low-cost PVDF High-Frequency Ultrasound Sensor Design and Manufacturing for Thermoacoustic Imaging Applications. In ICECS 2022 - 29th IEEE International Conference on Electronics, Circuits and Systems, Proceedings (pp.1-4) [10.1109/ICECS202256217.2022.9971002].

Low-cost PVDF High-Frequency Ultrasound Sensor Design and Manufacturing for Thermoacoustic Imaging Applications

Vallicelli E. A.
;
Baig M. H.;Chirico G.;Baschirotto A.;De Matteis M.
2022

Abstract

This work presents the development and experimental validation of an ultrasound piezoelectric sensor for thermoacoustic imaging that exploits printed circuit boards technology to define with high precision the sensor active area while minimizing manufacturing complexity and cost. A prototype single-channel sensor with 4x4 mm active area has been manufactured and experimentally validated in electrical and acoustic testbenches.
paper
Circuits and Systems for Biomedical Applications; Radiation Therapy; Ultrasound Sensors;
English
29th IEEE International Conference on Electronics, Circuits and Systems, ICECS 2022 - 24 October 2022through 26 October 2022
2022
ICECS 2022 - 29th IEEE International Conference on Electronics, Circuits and Systems, Proceedings
978-1-6654-8823-5
2022
1
4
none
Vallicelli, E., Baig, M., Gala, A., Chirico, G., Baschirotto, A., De Matteis, M. (2022). Low-cost PVDF High-Frequency Ultrasound Sensor Design and Manufacturing for Thermoacoustic Imaging Applications. In ICECS 2022 - 29th IEEE International Conference on Electronics, Circuits and Systems, Proceedings (pp.1-4) [10.1109/ICECS202256217.2022.9971002].
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/10281/404217
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